Department of Physics Clarkson University
Physics Seminar Presentation
Kassapa Gamagedara
Will speak on
Material Removal Mechanisms in Chemical Mechanical Planarization of Stainless Steel: A Case Study of 316/316L in Acidic Slurries using Alumina Abrasives*
Abstract
The use of flexible stainless steel (SS) substrates has considerably expanded over the last decade for applications in a broad range of devices including solar cells, electronic displays and electrochemical sensors. Adequate surface flatness is a critical requirement of these SS substrates, and chemical mechanical planarization (CMP) is a leading technique currently used to meet this requirement. Using a model system of 316/316L SS in acidic, hydrogen peroxide-based slurries with alumina abrasive particles, the present work explores how controlled rates of material removal can be achieved under chemically promoted CMP conditions. The detailed mechanisms of material removal are examined with tribo-electrochemical measurements, and the results demonstrate a detailed analytical protocol based on such measurements that can be used to evaluate slurry compositions for SS-CMP slurry.
*This work was performed in collaboration with recent Clarkson Graduate (PhD), Dr. David Santefort.
Friday, October 25th 2024
3:30 P.M. SC 344