“Slurry Chemistry and Nanoparticle Residue Removal in Post Chemical Mechanical Planarization Cleaning” Seminar – Mon. April 28

Clarkson University
Department of Chemical and Biomolecular Engineering
Materials Science & Engineering PhD Proposal Defense

Charmy Jani

Monday, April 28, 2025
2:00 PM
CAMP 372

ABSTRACT

As device architectures advance, Through Glass Via (TGV) and the classical Shallow Trench Isolation (STI) rocesses demand CMP slurries that combine high copper removal rates with minimal surface damage. While glycine has traditionally been regarded as a complexing agent, our findings reveal that it also acts as a dissolution inhibitor under acidic conditions. Beyond removal rate, glycine significantly impacts post-CMP
cleaning by altering surface chemisry and residue adhesion, key factors in advanced packaging and 3D integration.

This work will investigate the pH-dependent interfacial behavior of glycine in combination with oxalic acid, hydrogen peroxide, and the biodegradable surfactant, sodium dioctyl sulfosuccinate. The study aims to optimize slurry formulations across pH 2–10 for enhanced removal rate, selectivity, surface quality, and post-CMP cleanability. Specific objectives include quantifying Cu/Ta selectivity via corrosion potential shifts, analyzing surface films through AFM-based topography and force mapping, and evaluating nanoparticle adhesion and removal mechanisms on patterned wafers. Results will be modeled statistically to correlate additive interactions with electrochemical and physical performance metrics.

ADVISOR:

Professor Sitaraman Krishnan

COMMITTEE MEMBERS:

  • Professor Dipankar Roy
  • Professor Jihoon Seo
  • Professor Melissa King
  • Professor Simona Liguori

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