Electroactive Polymers for Electric-Field-Assisted Post-CMP Cleaning
Ramya Muralidaran
Abstract
Chemical Mechanical Planarization (CMP) is a critical process in semiconductor fabrication, but it leaves behind contaminants such as residual abrasives, organic films, and metallic impurities. Conventional post-CMP cleaning uses poly(vinyl acetal) brushes that rely on mechanical scrubbing. While widely used, these brushes tend to trap contaminants within their porous structure, leading to cross-contamination and reduced cleaning efficiency. Although methods such as ultrasonic-assisted cleaning have been developed, this study focuses on alternative brush materials engineered at the polymer level.
Specifically, this work investigates the synthesis, characterization, and post-CMP cleaning performance of electroactive polymer brushes designed for electric-field-assisted post-CMP cleaning. By incorporating electro-responsive functionalities into the brush structure, electrostatic forces would be generated under an applied electric field to actively repel particles from wafer surfaces. Reversing the field direction further aids in dislodging trapped contaminants from the brush itself. By optimizing polymer chemistry, crosslinking density, porosity, and electrostatic responsiveness, this approach aims to deliver a high-performance, low-defect cleaning solution suitable for the stringent demands of next-generation semiconductor manufacturing.
Friday, 5/2/2025 at 12 pm
CAMP 372
Advisor
Professor Sitaraman Krishnan
Other committee members
Professor Jihoon Seo
Professor Goodarz Ahmadi
Professor Devon Shipp
Professor Simona Liguori