Clarkson University’s Center for Advanced Materials Processing (CAMP) hosted the 27th International Symposium on Chemical Mechanical Planarization (CMP), bringing together a record-breaking 168 industry experts and academic scholars from around the globe. This year, the prestigious event took place in the vibrant setting of Saratoga Springs from July 27 to 30.
CMP is a critical step in the production of every modern computer chip. The CMP process is used to produce atomically flat surfaces as the chips are built up in a series of layers on a 12-inch silicon wafer. This degree of control is very technologically challenging – it is like flying around the Earth twice at the equator and not deviating in altitude more than the width of a human hair!
With decades-long leadership in CMP, Clarkson’s CAMP attracted distinguished representatives from top semiconductor companies, including chip makers like GlobalFoundries, Micron, and Intel, CMP tool manufacturers EBARA and Applied Materials, and CMP consumable suppliers such as DuPont, EMD, and 3M, along with many others. Their presence underscored the symposium’s significance as a pivotal platform for cutting-edge research and industry collaboration.
The symposium featured a powerful keynote presentation by Clarkson alum Mark Dougherty, President and GM of Tokyo Electron America. His talk, delivered during the conference dinner, provided guests with a compelling vision of the future of the semiconductor industry, artificial intelligence, and digital integration, sparking thought-provoking conversations on emerging trends and technologies.
The 27th International Symposium on CMP was a resounding success, marked by robust participation, insightful presentations, and meaningful exchanges of ideas. CAMP looks forward to continuing its tradition of excellence in future symposia.
For more information about the symposium and future events hosted by CAMP, please visit the CAMP website or contact camp@clarkson.edu.