Clarkson University Center for Advanced Materials Processing (CAMP) Seminar – Development of Ceria Slurry for Enhanced Chemical Mechanical Polishing (CMP) Performance
Prof. Taesung KimSchool of Mechanical Engineering and SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University Abstract: As the semiconductor device is shrinking and gets complicated, the chemical mechanical polishing (CMP) process has become important. Various types of abrasive particles are used as CMP slurry, and among them, ceria slurry is in the spotlight due to its […]