Clarkson University Department of Chemical and Bimolecular Engineering Seminar
“Towards a rational understanding of structure-dependentefficiency of organic corrosion inhibitors for Cu CMP” Murali Ramu Materials Science and Engineering Program, Clarkson University, Potsdam, NY, USAAbstractChemical mechanical planarization (CMP) is a crucial process in the back-end-of-line (BEOL) process of semiconductor manufacturing. The primary objective of CMP is to uniformly polish the copper (Cu) metal interconnects and […]